Semiconductor sector experiencing broad selloff with AMKR down 9% alongside peers; sector-wide decline suggests macro headwinds or market rotation rather than company-specific catalyst.
Triggers
Target upside +21%Average analyst target $76 vs current price $63
Lagged market 20d -27%
Bullish consensus · 8Multiple curated authors turned bullish during a discussion surge; historical monthly tendency has outperformed.
Authors active recently · 3Curated authors discussed it within the last 3 days.
Main discussion
AMKR declined 9% as part of broader semiconductor sector selloff affecting multiple peers from -3% to -15%.
Track it and catch the next move in discussion or price.
Price action and discussion heat
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Amkor Technology, Inc.
SemiconductorsNASDAQ
Amkor Technology, Inc. operates internationally, delivering external semiconductor packaging and testing solutions across North America, Japan, Europe, the Middle East, Africa, and the broader Asia Pacific region. Their comprehensive, end-to-end offerings encompass a range of processes, including semiconductor wafer bumping, probing, back-grinding, package conceptualization, final packaging, testing, and direct shipment services. The company's product portfolio features flip-chip scale packages, critical for devices like smartphones, tablets, and other portable consumer electronics. They also provide flip-chip stacked chip-scale packages, designed for layering memory atop digital basebands and as application processors in mobile units. Flip-chip ball grid array packages cater to diverse applications in networking, data storage, computing, and general consumer products. Wafer-level CSP packages find use in power management systems, transceivers, sensors, wireless charging technologies, codecs, radar systems, and specialized silicon components. Their wafer-level fan-out packages are integral for integrated circuits, alongside silicon wafer integrated fan-out technology, which offers a thinner alternative to traditional laminate substrates. Additionally, Amkor supplies lead frame packages, commonly employed in electronic devices requiring low to medium pin count analog and mixed-signal functionalities. Substrate-based wirebond packages facilitate the connection of a die to its substrate. Micro-electro-mechanical systems (MEMS) packages involve miniature mechanical and electromechanical components. Furthermore, their advanced system-in-package (SiP) modules are vital for a broad array of applications, including radio frequency and front-end modules, basebands, connectivity solutions, fingerprint sensors, display and touchscreen drivers, various sensors and MEMS, and NAND memory and solid-state drives. The company primarily serves a clientele comprising integrated device manufacturers, fabless semiconductor enterprises, original equipment manufacturers, and contract foundries. Established in 1968, Amkor Technology, Inc. maintains its corporate headquarters in Tempe, Arizona.
Market cap$15.5B
P/E35.6×
P/B3.4×
P/S2.2×
PEG0.98
EV/EBITDA12.7×
Net margin6.17%
Dividend yield0.53%
Valuation data from Financial Modeling Prep · TTM basis · Not investment advice
Targets · Rating consensus
Analyst target price (mean)$76.00Vs current +21.3%
Range$65.00$90.00
CommunityNo consensusNo clear community view
vs
Wall StreetHold14 firms
Buy 6Hold 7Sell 1
Wall Street consensus comes from FMP sell-side ratings and target prices · For reference only
