$BESI — investor discussion on X

Most active voices on $BESI

@beuvingjordy · Jordy Beuving · 48 mentions · 8.3K followers
@finnstockinger · Finn Stockinger · 9 mentions · 17.4K followers
@chipsandwafers · Chips & Wafers · 9 mentions · 9.3K followers
@paradislabs · Paradis Labs · 6 mentions · 72.7K followers
@chaimeisenberg · Chaim Eisenberg · 5 mentions · 3.6K followers
@investingvisual · Investing visuals · 4 mentions · 117.1K followers
@tradexwhisperer · Trade Whisperer · 4 mentions · 143.5K followers
@aleabitoreddit · Serenity · 3 mentions · 1.0M followers
@tomszczypka · Tom · 3 mentions · 2.9K followers
@convequity · Convequity · 3 mentions · 10.5K followers

Market feed · Market voices · SpikePanel

$BESI — investor discussion on X

Most active voices on $BESI

@beuvingjordy · Jordy Beuving · 48 mentions · 8.3K followers
@finnstockinger · Finn Stockinger · 9 mentions · 17.4K followers
@chipsandwafers · Chips & Wafers · 9 mentions · 9.3K followers
@paradislabs · Paradis Labs · 6 mentions · 72.7K followers
@chaimeisenberg · Chaim Eisenberg · 5 mentions · 3.6K followers
@investingvisual · Investing visuals · 4 mentions · 117.1K followers
@tradexwhisperer · Trade Whisperer · 4 mentions · 143.5K followers
@aleabitoreddit · Serenity · 3 mentions · 1.0M followers
@tomszczypka · Tom · 3 mentions · 2.9K followers
@convequity · Convequity · 3 mentions · 10.5K followers

Market feed · Market voices · SpikePanel

$BESI

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Community

AI synthesis + sources

The current packaging cycle is driven by advanced packaging tools, unlike the previous one focused on mainstream packaging. This shift is expected to lead to a larger cycle, with BESI being a laggard in this transition.

Main discussion

The current packaging cycle is driven by advanced packaging tools like Hybrid bonding and TC bonding.
The previous packaging cycle was driven by mainstream packaging capacity and wire bonders.

Different voices

$BESI is identified as a laggard in the current advanced packaging cycle.

View 1 source posts· AI-organized · For reference only, not investment advice

@qq_timmy· 30.2K followers
目前封裝「週期」進行到哪裡。而且根據這次週期驅動因素的不同，這次應該會比上一次更大。上一次週期主要是由主流產品的打線接合機（wire bonder）產能所驅動，COVID 期間 PC 是主要需求來源。但這次的產品組合非常不同。上一次封裝週期主要是在增加主流封裝的產能。打線接合機佔了資本支出的很大一部分。可以從設備供應商的相對表現中看出這一點： $BESI 是表現落後者。當時購買的工具很重要，但遠不如今天先進封裝所需設備那麼昂貴或技術複雜。這一次，支出正越來越多地流向真正的先進封裝工具： Hybrid bonding、TC bonding、

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Facts and opinions separated · All items sourced · Not investment advice